Total Ionic Contamination
This test method has been acknowledged as an important Process Control tool. It detects all ionic contaminants on PCB and PCBA, that could lead to corrosion during field use.
X-Ray is a non destructive analysis that detects macro defects of soldering process, like voids, insufficient PTH filling, non-wetting, etc… Features could be detected as low as 0,1µm
A destructive test that deepens the optical inspection. It is required to assess soldering joints goodness of components that couldn’t be optically accessible, for example BGAs.
It helps to detect if a correct thermal profile has been adopted, through intermetallic measurement.
Accelerated Thermal Cycle
ATC test exposes products to low and high air temperatures cycles to accelerate failures occurrence and simulate several years of normal use conditions.
It is performed according to IPC-A-610 standard from certified technicians. An inspection and measurement of SMT and PTH soldering joints to assure the conformity to the required IPC class.
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