TECHNOLOGY QUALITY SYSTEM INTEGRATOR

Qualification process

Before releasing a new project, assembled PCB quality can be assessed by qualifying soldering processes in all its features: chemical, solder alloys, thermal profiles, joints resistance.

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6 months program duration

6 months program duration

2 qualifications included

2 qualifications included

5.000 € total cost

5.000 € total cost

SATISFIED? Renew for other 6 months!

Total Ionic Contamination

Total Ionic Contamination

This test method has been acknowledged as an important Process Control tool. It detects all ionic contaminants on PCB and PCBA, that could lead to corrosion during field use.

X-Ray

X-Ray

X-Ray is a non destructive analysis that detects macro defects of soldering process, like voids, insufficient PTH filling, non-wetting, etc… Features could be detected as low as 0,1µm

Cross Section

Cross Section

A destructive test that deepens the optical inspection. It is required to assess soldering joints goodness of components that couldn’t be optically accessible, for example BGAs.
It helps to detect if a correct thermal profile has been adopted, through intermetallic measurement.

Accelerated Thermal Cycle

Accelerated Thermal Cycle

ATC test exposes products to low and high air temperatures cycles to accelerate failures occurrence and simulate several years of normal use conditions.

Optical Inspection

Optical Inspection

It is performed according to IPC-A-610 standard from certified technicians. An inspection and measurement of SMT and PTH soldering joints to assure the conformity to the required IPC class.

Report example

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